After the official launch of the Snapdragon 845 chipset last first week of December 2017 at the Snapdragon Tech Summit, it seems that the company has three other chipset coming this near 2018. These are the Qualcomm Snapdragon 670, 640, and 460 chipset to empower 2018 smartphones.
Both the Snapdragon 670 and 640 are equipped with 10nm LPP processing technology for more power efficient processor. They are also capable of supporting rear camera up to 26 MegaPixel or dual 13MP+13MP back cameras. While Snapdragon 460 can only support up to 21MP rear camera. The Snapdragon 670 is capable of having a maximum download speed of 1Gbps and upload of 150Mbps while the other two chipsets are capable of 600Mbps download and 150Mbps upload speeds.
These new processors are very exciting to look forward. They will empower the future mid-range smartphones this coming 2018.